| Item |
| Description |
| Layer |
| Flex board: 1-8 Layers Flex-Rigid Board: 2-6 Layers |
| Material |
| Pl, PET, PEN, FR-4, Dupont, SKC ... |
| Final Thickness |
| Flex Board: 0.002''-0.032''(0.05-0.8mm)
Flex-rigid board: 0.0024''-0.04''(0.06-1.0mm) |
| Surface Treatment |
| Lead-Free: Gold Plating, ENIG Gold, OSP, Immersion Tin ,Tin Plating |
| Max Panel Size |
| Maximum: 10''x80'' |
Min Trace
Width/Min Clearance |
| Inner: 1/2oz:3/3mil Outer:1/3oz-0.5oz:4/4mil
1oz:4/4mil 1oz:4/4mil
2oz:5/6mil 2oz:5/6mil |
The smallest via diameter / Hole PAD (Flex Board 2L-6L) |
| 6mil / 16mil |
The smallest via diameter / Hole PAD (Rigid Flex Board 2L-6L) |
| 10mil / 24mil |
| Copper Thickness |
| 1/3oz-2oz |
| Max/ Min insulation Thickness |
| 2mil/0.5mil (50um/12.5um) |
| Min Hole Size and Tolerance |
| Min hole:6mil
Tolerance:PTH±3mil,NPTH±2mil |
| Min Slot |
| 20mil x 30mil |
| Circuit trace to outline (1L~2L) |
| 6mil |
| Circuit trace to outline (>=3L) |
| 8mil |
| Solder Mask Alignment Tolerance |
| ±4mil |
| Silkscreen Alingment Tolerance |
| ±6mil |
| Silkscreen Line Width |
| 5mil |
| Gold Plating |
| Nickel:80u''-320u'' Gold:1u''-6u'' |
| Immersion Nickel / Gold |
| Nickel:80u''-300u'' Gold:1u''-3u'' |
| Tin Plating |
| Film: 40u''-600u'' |
| Immersion Tin |
| Film: 8u''-20u'' |
| OSP |
| Film: 8u''-20u'' |
| Test Voltage |
| Testing Fixture: 50-300V |
| Profile Tolerance of Punch |
| Accurate mould:±2mil |
| Ordinary mould:±4mil |
| Knife mould:±6mil |
